Dynamic Profiling


The new reference for process control and documentation in reflow soldering

for VP1000/6000 systems

Dynamic Profiling stands for simple and rapid temperature profile setup and absolute process stability in series operation

  • The operator enters the required temperature profile into the system control.
  • The soldering system adjusts the necessary control parameters automatically.
  • The assembly is soldered fully-automatically with the use of a reference measuring point / measurement standard.
  • The reference measuring point guarantees that all further assemblies are soldered in series operation with the adjusted temperature profile.

Your advantages

The four determining inputs for the setup of temperature profiles

1. Power input for the determination of the preheating gradient
2. Start temperature of the soak zone (°C) and soak time (sec.)
3. Power input for the determination of the soldering gradient
4. Holding time after reaching the final temperature

Produkt   Produkt

Nominal-actual value comparison of the favored temperature profile

Temperature profile of the measurement sensors